Nihon Genma was one of the exhibitors at SEMICON Taiwan 2023 from 6th to 9th of September.
We exhibited three main themes “Solder Paste for Fine Dispensing“, “Ultra-low Residue Flux” and “Super Fine Powder Type 9 Solder Paste“.
We’d like to extend our thanks to all the customers who stopped by at our booth.
For further information on the three themes, please refer to the link below.
