Lead-containing flux-cored solder
TNP
universal solder with good solderability and low spattering
![](https://genma.co.jp/en/wp-content/uploads/2019/06/2222-TNP-NP303.png)
Achieved both “surprising wettability” and “ultra-low spattering”.
High-dimension compatible cored solder. (JIS AA type Sn-3.0Ag-0.5Cu)
Spattering suppression effect
TNP-NP303 has less spattering compared to conventional Sn-3Ag-0.5Cu products.
![](https://genma.co.jp/en/wp-content/uploads/2019/06/TNP-NP3031-e1569307222615.png)
Wettability
TNP-NP303 maintains the same level of wettability as the conventional Sn-3Ag-0.5Cu product.
![](https://genma.co.jp/en/wp-content/uploads/2019/06/TNP-NP3032-e1569307356703.png)
Characteristics TNP-NP303
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Alloy Composition
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Sn-3.0Ag-0.5Cu
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Melting Point
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217℃~219℃
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♦ Flux Cored Solder |
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Halide Content |
0.07wt% |
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