universal solder with good solderability and low spattering
Achieved both “surprising wettability” and “ultra-low spattering”.
High-dimension compatible cored solder. (JIS AA type Sn-3.0Ag-0.5Cu)
Spattering suppression effect
TNP-NP303 has less spattering compared to conventional Sn-3Ag-0.5Cu products.
Wettability
TNP-NP303 maintains the same level of wettability as the conventional Sn-3Ag-0.5Cu product.
|
Characteristics TNP-NP303
|
|
|
|
Alloy Composition
|
Sn-3.0Ag-0.5Cu
|
|
 |
|
Melting Point
|
217℃~219℃
|
|
♦ Flux Cored Solder
|
|
Halide Content
|
0.07wt%
|
|
 |
