Lead-containing flux-cored solder
NP8303
The running cost of the tip can be greatly reduced
The frequency of soldering tip exchanges drastically decreases！
Significant reduction of flux and solder ball spattering！
Significant suppression of burnt residue and bubbles in flux residue
Compatible product against tipping
Iron tip life about 4 times longer than NP303 composition. (Sn-3.0Ag-0.5Cu)
Spattering surppression effect
Suppressed spattering compared to conventional products.
Scorching / bubble suppression effect
Suppressed flux burnt and bubbles compared to conventional products.
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Characteristics SHIN-NP8303
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Alloy Composition
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Sn-3.0Ag-0.5Cu-α
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Melting Point
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217℃~219℃
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♦ Flux Cored Solder |
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Halide Content |
0.07wt%±0.03 |
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