Lead-containing flux-cored solder


The running cost of the tip can be greatly reduced

The frequency of soldering tip exchanges drastically decreases!
Significant reduction of flux and solder ball spattering!
Significant suppression of burnt residue and bubbles in flux residue

Compatible product against tipping

Iron tip life about 4 times longer than NP303 composition. (Sn-3.0Ag-0.5Cu)

Spattering surppression effect

Suppressed spattering compared to conventional products.

Scorching / bubble suppression effect

Suppressed flux burnt and bubbles compared to conventional products.




  Characteristics      SHIN-NP8303



Alloy Composition







Melting Point





♦ Flux Cored Solder


Halide Content