Lead-containing flux-cored solder

DHB-RMA4


Flux core solder with emphasis on spattering control (JIS AA type Sn-3.0Ag-0.5Cu)

Flux cored solder that has a higher spattering suppression effect than conventional products.
Excellent spreadability and excellent solderability even for difficult base materials such as Ni.

 

 

  Characteristics        DHB-RMA4

 


 

Alloy Composition

 


 

Sn-3.0Ag-0.5Cu

 


 

 

Melting Point

 


 

217℃~219℃

 


♦ Flux Cored Solder

 

Halide Content

 

0.07wt%±0.03