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Flux core solder with emphasis on spattering control (JIS AA type Sn-3.0Ag-0.5Cu)
Flux cored solder that has a higher spattering suppression effect than conventional products.
Excellent spreadability and excellent solderability even for difficult base materials such as Ni.
Characteristics DHB-RMA4
Alloy Composition
Sn-3.0Ag-0.5Cu
Melting Point
217℃~219℃
♦ Flux Cored Solder
Halide Content
0.07wt%±0.03
Head Office
2-16-4 Mitsuya-kita, Yodogawa-ku, Osaka 532-0032, Japan
Phone +81 (0) 6 6302-1251 Fax. +81 (0) 6 6302-1250
Factory
3-8-10 Mitsuya-naka, Yodogawa-ku, Osaka 532-0036, Japan
Phone +81 (0) 6 6307-1010 Fax. +81 (0) 6 6302-1258
Tokyo Office
Espoar Building 2th Floor, 2-3-8 Iwamoto-cho, Chiyoda-ku, Tokyo 101-0032, Japan
Phone +81 (0) 3 3863-5665 Fax. +81 (0) 3 3863-5722