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Flux core solder with emphasis on spattering control (JIS AA type Sn-3.0Ag-0.5Cu)
Flux cored solder that has a higher spattering suppression effect than conventional products. 
Excellent spreadability and excellent solderability even for difficult base materials such as Ni. 
 
 
 
		
	
 
 
 
 
   Characteristics         DHB-RMA4 
 
 
 
 
 
 
 
 
Alloy Composition
 
 
 
 
Sn-3.0Ag-0.5Cu
 
 
 
 
   
 
 
 
Melting Point
 
 
 
 
217℃~219℃
 
 
 
 
♦ Flux Cored Solder
 
 
 
 
Halide Content
 
 
0.07wt%±0.03
 
 
 
 
 
 
 
 
 
 
Head Office 
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Phone +81 (0) 6 6302-1251 Fax. +81 (0) 6 6302-1250 
 
 
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Phone +81 (0) 6 6307-1010 Fax. +81 (0) 6 6302-1258 
 
 
Tokyo Office 
Espoar Building 2th Floor, 2-3-8 Iwamoto-cho, Chiyoda-ku, Tokyo 101-0032, Japan
 Phone +81 (0) 3 3863-5665 Fax. +81 (0) 3 3863-5722