Lead-containing flux-cored solder

DHB-RMA3


Flux cored solder with emphasis on spattering control (JIS AA type Sn-3.0Ag-0.5Cu)

This is a flux cored solder that has higher spattering suppression effect than conventional products.
Excellent spreadability and excellent solderability even for difficult base materials such as Ni.

 

 

  Characteristics        DHB-RMA3

 


 

Alloy Composition

 


 

Sn-3.0Ag-0.5Cu

 


 

 

Melting Point

 


 

217℃~219℃

 


♦ Flux Cored Solder

 

Halide Content

 

0.07wt%±0.03