Solder Paste
Jet Dispensing Paste
winDot-F005-NP303
For Jet Dispensing
Realized both fine coating and meltability at the same time!
Achieved the smallest dispensed diameter in the world and no nozzle clogging!
Compatible with High-speed and Fine Jet Dispensing
BGA Application Evaluation (Ceramic Plate)
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∅200μm
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∅250μm
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∅300μm
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Best Solution for Solder Application to Non-printable Parts such as 3D Structures
Solder Supply to dented places such as various modules and LED modules using cavity structure printed circuit boards.
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Excellent Meltability
Melted with even Small Amount of Application
BGA Dot Coating Evaluation (on Actual Substrate)
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0.65mm Pitch BGA ∅200μm x 2 dot
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0.4mm Pitch BGA ∅200μm
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Before Reflow
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O2：500 ppm After Reflow |
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There is no particular problem with the applied condition and subsequent reflow process.
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Characteristics winDot-F005-NP303
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Alloy Composition
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Sn-3.0Ag-0.5Cu Sn-58Bi Sn-10Sb
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Powder Type
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Type5, 6, 7
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♦ Jet Dispensing Paste | ||
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Halide Content |
<0.03wt% |
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