Solder Paste
Jet Dispensing Paste
winDot-F005-NP303
Solder Paste for Jet Dispenser
Realized both fine coating and meltability at the same time!
Achieved the smallest dispensed diameter in the world and no nozzle clogging!
Compatible with High-speed and Fine Jet Dispensing
High-Speed Precision: Achieves stable, high-speed, and ultra-fine dispensing for φ100μm class dots using Jet Dispensing.
Best Solution for Solder Application to Non-printable Parts such as 3D Structures
Solder Supply to dented places such as various modules and LED modules using cavity structure printed circuit boards.
Thickness adjustment is possible by multiple overlapping shots.
Coating shape of multi-stage shots (1 time, 3 times, 5 times).
Excellent Meltability
Melted with even Small Amount of Application
BGA Dot Coating Evaluation (on Actual Substrate)
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Characteristics winDot-F005-NP303
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Alloy Composition
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Sn-3.0Ag-0.5Cu
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Powder Type
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Type5, 6, 7
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Halide Content |
<0.03wt% |
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