Dust from Flux Residue after Soldering

 

The epoxy resin that sticks the flux residue prevents optical components such as lenses from contamination.

 

 

Shear Strength after Reflow Soldering（for 0603 Sized Chip Component)

 

Compared to conventional rosin based flux paste, there is high shear strength and less deterioration after thermal shock test.

 

Initial Shear Strength (kgf)

-40°C~125°C 100 Cycles

Shear Strength after 100 heat cycle at -40°C~125°C (kgf)

 

 

 

 

Print Stability during Use

 

Maintains viscosity and solderability without significant changes for up to 8 hours of continuous printing.

 

Viscosity Change with Continuous Printing	Initial
	After 8 Hours

 

 

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	Characteristics 　SB58-EPP101-T4　　SB58-EPC101-T4
	Supply of Solder Paste	Printing	Dispensing
	Alloy Composition	Sn-58Bi			♦　Epoxy Resin
	Powder Type	Type4、5、6			♦　Low Temperature
	Halide Content	<0.05wt％
	Reflow Oven	Possible under air reflow oven (N2 reflow oven necessary for type5 and type 6)
	Storage Condition	<-15℃			Customizing possible according to the product and the process.