Solder Paste

NEW
Epoxy Resin
Low Temperature Solder

SB58-EPP/EPC101-T4


 

 

Dust from Flux Residue after Soldering

 

The epoxy resin that sticks the flux residue prevents optical components such as lenses from contamination.

 

 

Shear Strength after Reflow Soldering(for 0603 Sized Chip Component)

 

Compared to conventional rosin based flux paste, there is high shear strength and less deterioration after thermal shock test.

 

Initial Shear Strength (kgf)

 

-40°C~125°C

100 Cycles

Shear Strength after 100 heat cycle

at -40°C~125°C (kgf)

 

 

 

 

Print Stability during Use

 

Maintains viscosity and solderability without significant changes for up to 8 hours of continuous printing.

 

Viscosity Change with Continuous Printing

 

Initial

 

After 8 Hours

 

 


 

 

 

Characteristics  SB58-EPP101-T4  SB58-EPC101-T4

 


 

Supply of

Solder Paste


 

Printing

 


 

Dispensing

 


 

 

Alloy Composition

 


 

Sn-58Bi

 


♦ Epoxy Resin

 

Powder Type

 


 

Type4

 


♦ Low Temperature

 

Halide Content

 


 

<0.05wt%

 


 

Reflow Oven

 


 

Possible under air reflow oven

 


 

Storage Condition

 

<-15℃

Customizing possible according to the product and the process.