Solder Paste
COSMO series
Low Ag
PW231-ST355-GQ-CC-1
Low Ag
Significant cost reduction is realized by low silver composition.
Higher joint strength and better thermal shock resistance compared with Sn-3Ag-0.5Cu.
Even delivery and storage under normal temperature, our solder paste can remain in stable
quality without deterioration unlike the conventional type . it become easier to handle.
Designed for preventing BGA Head-In-Pillow defect
PW231 Joint Reliability
Room Temperature Storage Compatible
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Refrigerated Storage (Reference)
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35°C Storage (After 1 Month)
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35°C Storage (After 3 Month)
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Solder Paste Appearance
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No Deterioration Silmilar to Refrigerated Storage
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No Deterioration Silmilar to Refrigerated Storage
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Printability (0.4mm pitch QFP)
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No Deterioration Silmilar to Refrigerated Storage
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No Deterioration Silmilar to Refrigerated Storage
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Designed for Preventing BGA Head-in-pillow Defect
It is develop for Complete BGA Ball with Solder Paste.
Used the Oxidized BGA to Confirm that there was No Melting.
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Incomplete 0% |
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Characteristics PW231-ST355-GQ-CC-1
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Alloy Composition
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Sn-1.0Ag-3.0Bi-0.5Cu
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Melting Point
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207℃~223℃
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♦ Low Ag |
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Powder Type
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Type4
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Halide Content |
0.14wt%±0.05 |
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