Solder Paste
NEW
Water Soluble Paste for Fine Soldering
NP303-WS6301-T6
◆For semiconductor packaging, applicable for solder powder of type 6,7
◆Excellent cleanability, fine printing, slumping, solderability and void performance
Printability and Solderability at Fine Apertures
♦ Excellent Printability and Solderability at ∅75μm Aperture
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After Printing
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After Reflow
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Slump at Printing and Heating
♦ Excellent Slump after Heating at 150µm Gap : No Short
Stability of Solder Paste during 8 Continuous Printing(Viscosity and Thixotropy)
♦ Stable Viscosity and Thixotropy during Continuous Printing.
♦ Maintain Printing Shape without Slump.
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| Conventional Product | NP303-WS6301-T6 | |
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0 Hr
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| 8 Hr |  |
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Void
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Conventional Product
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NP303-WS6301-T6
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| Void Rate: 46% | Void Rate: 9% |
Cleanability
Excellent cleanability!!
Cleaning Condition
Hot Water 60°C, Ultrasonic 4 minutes
Observed by SEM
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Conventional Product
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NP303-WS6301-T6
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Characteristics NP303-WS6301-T6
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Alloy Composition
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Sn-3.0Ag-0.5Cu
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Melting Point
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217℃~219℃
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♦ Water Soluble Paste for Fine Soldering |
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Powder Type
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Type6, 7
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Halide Content |
<0.05wt% |
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