Non-halogen Solder Paste that can be Soldered by Atmospheric Reflow
Test for wettability to each base materials
Test Method
Used a Metal Mask with a Thickness of 0.2mm and an Opening of φ6.5mm Pattern.
Printed, Appled and Soldered to the Following Base Materials.
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Copper Plate
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Brass Plate
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Nickel Plate
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Characteristics NP303-NH355-GQ-2
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Alloy Composition
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Sn-3.0Ag-0.5Cu
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Melting Point
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217℃~219℃
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♦ Hallogen Free
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Powder Type
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Type4
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Halide Content
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<0.01wt%
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