Solder Paste
NEW
Fine Soldering for Mini/Micro LED
NP303-GSD003-T6
Stable Printability in order to Mount a lot of Mini LEDs on Display Substrates
|
NG |
|
OK |
||
|
LED Chips not Standing Flat after Mounting
|
WHY
♦ The supply of solder paste is uneven. When solder paste is too much or too less, it would cause the tombstone defect.
♦ Solder paste is wetting unevenly. |
 |
WHY
♦ The supply of solder paste is even.
♦ Solder paste is wetting evenly. |
|
By adjusting the viscosity and thixotropy, printability is improved and the tombstone defect is prevented.
|
Conventional Product |
|
NP303-GSD003-T6 |
|
|
|
|
|
Solder Paste after Printing with Unequal Height |
|
Solder Paste after Printing with Equal Height |
Stability of Solder Paste during 8 Continuous Printing
⊳Minimize viscosity’s and thixothropy’s reduction during the continuous printing.
⊳With ∅100µm square aperture, printability and solderability are maintained.
 |
 |
|
0 Hr |
4 Hr |
8 Hr |
|
| Excellent Printability |
|
|
|
| Excellent Solderability |
|
|
|
|
Characteristics NP303-GSD003-T6
|
||||
|
Alloy Composition
|
Sn-3.0Ag-0.5Cu
|
 |
||
|
Melting Point
|
217℃~219℃
|
♦ Fine Soldering for Mini/ Micro LED |
||
|
Powder Type
|
Type6, 7, 8
|
|||
|
Halide Content |
<0.05wt% |
 |
||
