Solder Paste


Nickel Compatible


NP303-GM855-T4-D


Improved Wettability to Ni

Improved wettability for base materials that are difficult to wet,
such as Ni, compared to conventional pastes.

 

 

Nickel Compatible

 

Wetting Efficacy and Dewetting Test

 

Test Method: Based on JIS Z 3284 4 4.1

 

Copper Plate

 

Brass Plate

 

Nickel Plate

 

 

 


 

 

 

  Characteristics    NP303-GM855-T4-D

 


 

Alloy Composition

 


 

Sn-3.0Ag-0.5Cu

 


 

 

Melting Point

 


 

217℃~219℃

 


♦ Compatible with Ni

 

Powder Type

 


 

Type4

 


♦ Good Wetting of the Component

 

Halide Content

 

0.09wt%±0.05