Solder Paste
Nickel Compatible
NP303-GM855-T4-D
Improved Wettability to Ni

Improved wettability for base materials that are difficult to wet, 
such as Ni, compared to conventional pastes.
Nickel Compatible
Wetting Efficacy and Dewetting Test
Test Method: Based on JIS Z 3284 4 4.1
| Copper Plate 
 | Brass Plate 
 | Nickel Plate 
 | 
|  |  |  | 
| Characteristics NP303-GM855-T4-D 
 | ||||
| 
 Alloy Composition 
 | 
 Sn-3.0Ag-0.5Cu 
 |  | ||
| 
 Melting Point 
 | 
 217℃~219℃ 
 | ♦ Compatible with Ni | ||
| 
 Powder Type 
 | 
 Type4 
 | ♦ Good Wetting of the Component | ||
| 
 Halide Content | 
 0.09wt%±0.05 |  | ||




