Solder Paste
Nickel Compatible
NP303-GM855-T4-D
Improved Wettability to Ni
Improved wettability for base materials that are difficult to wet,
such as Ni, compared to conventional pastes.
Nickel Compatible
Wetting Efficacy and Dewetting Test
Test Method: Based on JIS Z 3284 4 4.1
Copper Plate
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Brass Plate
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Nickel Plate
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Characteristics NP303-GM855-T4-D
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Alloy Composition
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Sn-3.0Ag-0.5Cu
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Melting Point
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217℃~219℃
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♦ Compatible with Ni |
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Powder Type
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Type4
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♦ Good Wetting of the Component | ||
Halide Content |
0.09wt%±0.05 |