Less Flux Residue Type Solder Paste
Solder Paste with Almost Noflux Residue after Reflow
Excellent Wettability
Excellent Wettability for even Base Materials that are Hard to Wet such as Ni
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Sample Rate
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Wettability to Nickel
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Good Wettability!
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| SEM Observation Result |
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No Flux Residue! |
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Characteristics NP303-FLV-T4
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Alloy Composition
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Sn-3.0Ag-0.5Cu
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Melting Point
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217℃~219℃
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♦ Less Flux Residue
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Powder Type
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Type4
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Halide Content
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0.3wt%±0.05
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