Solder Paste
Formic Acid Reflow Compatible
NP303-FL001-T4
Residue-less Solder Paste for Formic Acid Reflow Oven
Residue-less Solder Paste for Formic Acid Reflow Oven
No Need for Cleaning due to Less Flux Residue
Formic Acid Reflow Test Results
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Appearance Photo
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♦ No Solder Wettability Problem
♦ No Flux Residue |
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X-ray Transmission Photo
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♦ No Void |
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Wetting on Cu Plate
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♦ No flux Residue
♦ Since Our Products have Little Slump-in-heat, the Surroundings of the Solder are Clean. |
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Characteristics NP303-FL001-T4
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Alloy Composition
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Sn-3.0Ag-0.5Cu
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Melting Point
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217℃~219℃
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♦ Compatible with Formic Acid Reflow |
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Powder Type
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Type4
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♦ Good Wettability | ||
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Halide Content |
<0.01wt% |
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