Solder Paste
NEW
Epoxy Resin
NP303-EPP/EPC101-T4
Shear Strength after Reflow Soldering（for 0603 Sized Chip Component)
Compared to conventional rosin based flux paste, there is high shear strength and less deterioration after thermal shock test.
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Initial Shear Strength (kgf) |
-40°C~125°C 100 Cycles
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Shear Strength after 100 Heat Cycle at -40°C~125°C (kgf)
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Shear Tester:
Tension Testing MAchine
SEISHIN SS-39WD |
Print Stability during Use
Maintains viscosity and solderability without significant changes for up to 8 hours of continuous printing.
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Viscosity Change with Continuous Printing
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Initial
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After 8 Hours
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Characteristics NP303-EPP101-T4 NP303-EPC101-T4
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Supply of Solder Paste |
Printing
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Dispensing
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Alloy Composition
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Sn-3.0Ag-0.5Cu
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♦ Epoxy Resin |
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Powder Type
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Type4、5、6
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♦ Strength of Solder Joint |
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Halide Content
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<0.05wt％
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Reflow Oven
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Possible under air reflow oven (N2 reflow oven necessary for type5 and type 6) |
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Storage Condition |
<-15℃ |
Customizing possible according to the product and the process. | |||
