Solder Paste
NEW
For Air Pressure Dispensing and Laser Soldering
NP303-DPS501-T4/T5
・Area Dispensing Solder Paste
・Reduce Solder Balls Splashing during Laser Soldering
Improve Aggregation
Prevent Flux from Spreading and Improve Solder Splash Problem during Soldering
Laser Heating、Air Reflow Soldering
Reduce Solder Balls Splashing from the Solder Paste even with Large Amount Dispensing and High Output
Laser Heating、Air Reflow Soldering
【Amount of Solder Paste】Approximately 7 mg
Evaluation
|
Initial
|
|
|
|
|
After 200k-shot
|
|
|
|
| Able to Continuous Dispensing up to 200k-shot | |||
|
Characteristics NP303-DPS501-T4/T5
|
||||
|
Alloy Composition
|
Sn-3.0Ag-0.5Cu
|
 |
||
|
Melting Point
|
217℃~219℃
|
♦ For Air Pressure Dispensing and Laser Soldering |
||
|
Powder Type
|
Type4, 5
|
|||
|
Halide Content |
<0.35wt% |
 |
||
