Solder Paste
NEW
For Air Pressure Dispensing and Laser Soldering
NP303-DPS101-T4/T5
Solder Paste with Excellent Continuous Stable Dispensing
and to be Applicable for Laser Soldering.
Stable Dispensability and Excellent Solderability with Rapid Laser Heating even with Halogen-Free
Stable Dispensing Appearance
Type5 Solder Paste
Keep Stable Dispensing after 300,000 Shots
Dispinsing Diameter: 300μm
Continuous Stable Volume of Dispensing
The Number of Dispensing Change with the Amount of Dispensing
Comparison of Solder Melting during Laser Heating
Compared to conventional products, wettability is improved and spattering is reduced by about 30%.
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QFP
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Connectors
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NP303-DPS101-T4/ T5
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| Conventional Products |  |
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Reflow Test by Area-Laser
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Printed Solder Paste of NP303-DPS101-T4
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Local Reflow by Area-Laser
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Equipment: Selective Reflow Equipment of Laserssel Co. ( Cooperated with Techno Alpha Co.)
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Characteristics NP303-DPS101-T4/T5
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Alloy Composition
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Sn-3.0Ag-0.5Cu
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Melting Point
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217℃~219℃
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♦ For Air Pressure Dispensing and Laser Soldering |
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Powder Type
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Type4, 5
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Halide Content |
<0.1wt% |
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