Solder Paste
Low Void
NP303-CQV-1K
Achieved Under 5％ Ultra-low Void
Achieved ultra-low void by significantly increasing the fluidity of the flux, compared to conventional paste.
Void Suppression
Achieved Under 5％ Ultra-low Void!
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N2 Reflow
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Air Reflow
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Part Shape
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LGA
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QFN
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Void Ratio 4.2%
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Void Ratio 4.3%
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Power Transistor TO263 |
Void Ratio 2.6% |
Void Ratio 4.2% |
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*Compatible with Various Parts and Air Reflow Soldering.
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Characteristics NP303-CQV-1K
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Alloy Composition
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Sn-3.0Ag-0.5Cu
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Melting Point
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217℃~219℃
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♦ Low Void |
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Powder Type
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Type4
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Halide Content |
0.06wt%±0.02 |
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