Solder Paste
COSMO series
General Use (Room Temperature Storage Compatible)
NP303-COSMO-ZQ-C
Solder Paste Compatible with Room Temperature Storage
![](https://genma.co.jp/en/wp-content/uploads/2019/06/111-NP303-COSMO-ZQ-C.png)
Even delivery and storage at room temperature, our solder paste can remain in stable quality
without deterioration unlike the previous model. It become easier to handle. (JIS AA type Sn-3.0Ag-0.5Cu)
6 Month Guarantee at 35℃
Storage Period Change with Viscosity at 35℃ and 50℃ Storage Temperature
①Since viscosity and characteristics can maintain as initial level even after 6 month at 35℃ it’s able to storage 6months at room temperature.
②Since viscosity and characteristics can maintain as initial level even after 1 month under 50℃ it’s able to transport at room temperature.
![](https://genma.co.jp/en/wp-content/uploads/2019/06/NP303-COSMO-ZQ-C-1-EN.png)
Refrigerated Storage (Reference)
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35°C Storage (After 6 months)
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50°C Storage (After 1 month)
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Solder Paste Appearance
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No Deterioration Silmilar to Refrigerated Storage
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No Deterioration Silmilar to Refrigerated Storage
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Printability (0.4mm pitch QFP)
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No Deterioration Silmilar to Refrigerated Storage
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No Deterioration Silmilar to Refrigerated Storage
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Melting (0.4mm pitch QFP)
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No Deterioration Silmilar to Refrigerated Storage |
No Deterioration Silmilar to Refrigerated Storage |
Designed for Low Voiding Compatible
Product Designed for Ultra-Low Voiding Performance
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Solder Paste un-coped with Void |
NP303-COSOMO-ZQ-C, coped with void |
Characteristics NP303-COSMO-ZQ-C
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Alloy Composition
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Sn-3.0Ag-0.5Cu
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Melting Point
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217℃~219℃
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♦ General Use (Compatible with Normal Temperature Storage) |
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Powder Type
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Type4
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Halide Content |
0.08wt%±0.02 |
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