Solder Paste
NEW
For Printing and Area Laser
COSMO series
NP303-COSMO-LA501-T4
Solder Paste for Area Laser Soldering
Excellent Solderability under Rapid Heating
Reliable Joint Quality Ensured with Short-time Heating
Capable of Room-temperature Transportation and Storage
Reduced Flux And Solder Ball Spattering Under Rapid Heating
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Flux Spattering Component Misalignment |
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NP303-COSMO-LA501-T4 |
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Solder Ball Spattering Component Misalignment |
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Maintains Self-alignment Capability Even With Short-time Heating
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Conventional Product |
NP303-COSMO-LA501-T4 |
Good Solder Joint Formation With Short-time Heating
Confirmation of intermetallic diffusion layer formation between substrate and component electrodes after soldering
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Cross-section of QFN Solder Joint |
Cross-section of MLCC Solder Joint |
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Terminal Electrode Solder Joint |
Enlarged View of Joint Interface |
Overall Solder Joint |
Enlarged View of Joint Interface |
Void Reduction by Area Laser Soldering
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Void rate:10.13％ |
Void rate:1.19％ |
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Heating by Reflow Oven |
Heating by Area Laser |
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Characteristics NP303-COSMO-LA501-T4
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Alloy Composition
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Sn-3.0Ag-0.5Cu
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Melting Point
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217℃~219℃
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♦ For Aera Laser Soldering |
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Powder Type
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Type4
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♦ Compatible at Room Temperature |
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Halide Content |
0.08±0.02wt% |
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