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SEMICON Japan 2023

SEMICON Japan 2023


Nihon Genma will be one of the exhibitors in SEMICON Japan 2023, which will be hold at JAPAN BUILD TOKYO on December 13th~15th, 2023.


We are going to exhibit the products below:


・Products for Semiconductor Package! Water Soluble Solder Paste, Epoxy Resin-based Solder Paste

・For 3D Structural Assembly! Solder Paste for Micro-dispesing

・Toward Ultra-miniaturization of Joint! Products Applied by Ultra-fine Solder Powder Type9 (1~5μm)

・Eliminate Cleaning Process after Assembly!  Less Flux Residue Solder Paste (General Reflow or Applied for Formic Acid Reflow)

・Flux Products to Support Solder Joint! Ultra-low Residue Flux, Colorant Containing Flux


Date: Dec 13 (Wed.)~Dec 15 (Fri.), 2023


Booth: 1018 (as the red pin in the map)



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Please follow the instructions provided in the link below to fill in the required information and download your badge.

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We look forward to seeing you at the event.