Nihon Genma will be one of the exhibitors in SEMICON Japan 2023, which will be hold at JAPAN BUILD TOKYO on December 13th~15th, 2023.
We are going to exhibit the products below:
・Products for Semiconductor Package! Water Soluble Solder Paste, Epoxy Resin-based Solder Paste
・For 3D Structural Assembly! Solder Paste for Micro-dispesing
・Toward Ultra-miniaturization of Joint! Products Applied by Ultra-fine Solder Powder Type9 (1~5μm)
・Eliminate Cleaning Process after Assembly! Less Flux Residue Solder Paste (General Reflow or Applied for Formic Acid Reflow)
・Flux Products to Support Solder Joint! Ultra-low Residue Flux, Colorant Containing Flux
Date: Dec 13 (Wed.)~Dec 15 (Fri.), 2023
Venue: JAPAN BUILD TOKYO
Booth: 1018 (as the red pin in the map)
To enter the venue, it is necessary to display the badge.
Please follow the instructions provided in the link below to fill in the required information and download your badge.
We look forward to seeing you at the event.
