We’re excited to announce our presence at the 38th NEPCON JAPAN Exhibition, happening at Tokyo Big Sight from January 24th to January 26th, 2024.
Date: January 24th (Wednesday) to January 26th (Friday), 2024
Venue: Tokyo Big Sight
Our Booth: E1-27
Explore our booth for a glimpse of cutting-edge products:
- ・For 3D Structural Assembly! Solder Paste for Micro-dispensing!
- ・Toward Ultra-miniaturization of Joint! Products Applied by Ultra-fine Dolder Powder Type9 (1~5μm)
- ・Ultra-low Void Solder Paste for Automotive and High Reliability Products
- ・Products for Semi-conductor Package! Water Soluble Solder Paste and Epoxy Resin-based Solder Paste
- ・Eliminate Cleaning Process after Assembly! Less Flux Residue Paste Applied for Formic Acid Reflow
- ・Reduced Environmental Impact! Low Temperature Solder Paste!
To join us, an invitation is a must.
Simply download it from the link below and bring it along.
We sincerely hope you’ll seize this opportunity to visit our booth.
