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Join Us at the 38th NEPCON JAPAN 2024

We’re excited to announce our presence at the 38th NEPCON JAPAN Exhibition, happening at Tokyo Big Sight from January 24th to January 26th, 2024.


Date: January 24th (Wednesday) to January 26th (Friday), 2024

Venue: Tokyo Big Sight

Our Booth: E1-27


Explore our booth for a glimpse of cutting-edge products:


  • For 3D Structural Assembly! Solder Paste for Micro-dispensing!
  • Toward Ultra-miniaturization of Joint! Products Applied by Ultra-fine Dolder Powder Type9 (1~5μm)
  • Ultra-low Void Solder Paste for Automotive and High Reliability Products
  • Products for Semi-conductor Package! Water Soluble Solder Paste and Epoxy Resin-based Solder Paste
  • Eliminate Cleaning Process after Assembly! Less Flux Residue Paste Applied for Formic Acid Reflow
  • Reduced Environmental Impact! Low Temperature Solder Paste!


To join us, an invitation is a must.

Simply download it from the link below and bring it along.

Invitation Download Link


We sincerely hope you’ll seize this opportunity to visit our booth.