Lead-containing flux-cored solder
STU
Nihon Genma's best flux cored solder was launched
Clean finish with less burnt residue and bubbles.
Work environment can be improved by very low level of fume.
Ensured outstanding wettability.
Burn suppression effect
Significantly reduces residue and solder iron burnt.
Bubble suppression effect
Significantly reduces bubbles inside flux residue .
Fume suppression effect
Significantly reduced flux fume and improved working environment.
Wettability
Excellent wettability compared to conventional products.
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Characteristics STU-NP303
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Alloy Composition
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Sn-3.0Ag-0.5Cu
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Melting Point
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217℃~219℃
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♦ High Performance for High Temperatures |
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Halide Content |
<0.5wt% |
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