Solder Paste
COSMO series
General Use (Room Temperature Storage Compatible)
NP303-COSMO-ZQ-C
Solder Paste Compatible with Room Temperature Storage
Even delivery and storage at room temperature, our solder paste can remain in stable quality
without deterioration unlike the previous model. It become easier to handle. (JIS AA type Sn-3.0Ag-0.5Cu)
6 Month Guarantee at 35℃
Storage Period Change with Viscosity at 35℃ and 50℃ Storage Temperature
①Since viscosity and characteristics can maintain as initial level even after 6 month at 35℃ it’s able to storage 6months at room temperature.
②Since viscosity and characteristics can maintain as initial level even after 1 month under 50℃ it’s able to transport at room temperature.
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Refrigerated Storage (Reference)
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35°C Storage (After 6 months)
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50°C Storage (After 1 month)
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Solder Paste Appearance
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No Deterioration Silmilar to Refrigerated Storage
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No Deterioration Silmilar to Refrigerated Storage
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Printability (0.4mm pitch QFP)
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No Deterioration Silmilar to Refrigerated Storage
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No Deterioration Silmilar to Refrigerated Storage
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Melting (0.4mm pitch QFP)
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No Deterioration Silmilar to Refrigerated Storage |
No Deterioration Silmilar to Refrigerated Storage |
Designed for Low Voiding Compatible
Product Designed for Ultra-Low Voiding Performance
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Solder Paste un-coped with Void |
NP303-COSOMO-ZQ-C, coped with void |
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Characteristics NP303-COSMO-ZQ-C
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Alloy Composition
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Sn-3.0Ag-0.5Cu
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Melting Point
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217℃~219℃
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♦ General Use (Compatible with Normal Temperature Storage) |
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Powder Type
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Type4
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Halide Content |
0.08wt%±0.02 |
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